copper foam

Copper foam is a new type of lightweight metal material with a foam-like structure and a surface filled with countless small holes. These small holes give copper foam light weight, good thermal conductivity, energy absorption and other characteristics.
Copper foam can be prepared in various ways and has good electrical conductivity. Due to its special structure and properties, copper foam has a wide range of applications in the field of electrical resistance. In addition, the melting point of copper foam is 1083 ℃, this property makes it has good stability in high temperature environment.
Copper foam is widely used in electronics, communication, automobile, construction and other fields, for example, it can be used to make heat dissipation materials for electronic equipment and heat sinks for automobile engines. The advantages of copper foam are mainly reflected in its low density and good electrical conductivity, these properties make it have a large specific surface area, which can improve the heat transfer efficiency of the material.